XC2S100-5TQG144I DataSheet
DATASHEET
XC2S100-5TQG144I 描述
Figure 1 shows a typical soldering profile for the D2 and D3 Packages when soldering a to a printed circuit board. The profile will vary from system to system and solders to solders. Factors that can affect the profile include the type of sol- dering system used, density and type of components on the board or substrate material being used. This profile shows temperature versus time. The two profiles described are based on a high density and a low density board. The type sol- der used was 62/36/2 Tin Lead Silver with a melting point between 177-189ºC. An convection/infrared soldering reflow system was used. The circuit and solder joints heat up first due to their mass followed by the components which typi- cally run 30 degrees cooler than the solder joints.
XC2S100-5TQG144I 特点
Serial Clock (SCK) - This pin is used to synchronize the communication between the microcontroller and the IS25C64, IS25C32. Op-codes, byte addresses, or data present on the SI pin and latched on the rising edge of the SCK. Data on the SO pin is updated on the falling edge of the SCK for SPI modes (0,0 & 1,1).
XC2S100-5TQG144I 应用
Extended data out does not place the data in / data out pins (DQs) into the high-impedance state with the rising edge of CAS. The output remains valid for the system to latch the data. After CAS goes high, the DRAM decodes the next address. OE and W can control the output impedance. Descriptions of OE and W further explain EDO operation benefit.
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These data selectors/multiplexers contain invert