xc3s1600e-4fgg400c DataSheet
DATASHEET
xc3s1600e-4fgg400c 描述
The DS1249 devices execute a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip Enable) and OE (Output Enable) are active (low). The unique address specified by the 18 address inputs (A0 - A17) defines which of the 262,144 bytes of data is accessed. Valid data will be available to the eight data output drivers within tACC (Access Time) after the last address input signal is stable, providing that CE and OE access times are also satisfied. If OE and CE access times are not satisfied, then data access must be measured from the later-occurring signal ( CE or OE ) and the limiting parameter is either tCO for CE or tOE for OE rather than tACC.
xc3s1600e-4fgg400c 特点
The XC3S1600E-4FGG400C is a digital thermal supervisor capable of measur- ing its own internal temperature and that of a remote PN junc- tion. The remote junction may be an inexpensive commodity transistor, e.g., 2N3906, or an embedded thermal diode such as found in Intel Pentium* II/III/IV CPUs, AMD Athlon* CPUs, and Xilinx Virtex* FPGA´s. A 2-wire SMBus* 2.0 compatible serial interface is provided for host communication. Remote temperature is measured with 1C accuracy and 9-bit to 12-bit resolution (programmable). Independent high, low, and over-temperature thresholds are provided for each zone. The advanced integrating A/D converter and analog front-end reduce errors due to noise for maximum accuracy and mini- mum guardbanding. The interrupt output signals temperature events to the host, including data-ready and diode faults. Critical device settings can be locked to prevent changes and insure failsafe operation. The clock, data, and interrupt pins are 5V-tolerant regardless of the value of VDD. They will not clamp the bus lines low even if the device is powered down. Superior accuracy, failsafe operation, and small size make the XC3S1600E-4FGG400C an excellent choice for the most demanding thermal management applications.
xc3s1600e-4fgg400c 应用
XC3S1600E-4FGG400C/50 is a dual power MOSFET module designed for fast swiching applications of high voltage and current. 2 devices are serial connected. The mounting base of the module is electrically isolated from semiconductor elements for simple heatsink construction.
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